|About this Abstract
||2018 TMS Annual Meeting & Exhibition
||Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder
||Lead-free Nano-Solder Pastes for the Soldering of Cu-Cu Thin Wires
||Edward Fratto, Evan Wernicki, Yang Shu, Fan Gao, Zhiyong Gu
|On-Site Speaker (Planned)
As the field of electronics strives toward smaller, lighter and more powerful components and integrated devices, small-scale nanosoldering will become necessary and inevitable. In this work, we demonstrate the formation of micro-scale solder joints between copper-copper (Cu-Cu) thin wires by tin-indium alloy nanoparticle enabled lead-free solder pastes. Electrical resistivity and mechanical measurements were conducted on reflowed joints, evaluating quality and performance compared with commercial lead-free solder pastes. The solder nanoparticles were synthesized using surfactant-assisted reduction chemistry and characterized for size, structure, and melting temperature by SEM, TEM, EDS, XRD, and DSC. The nanosolder paste is capable of melting into solder balls below 500 micrometers in diameter, demonstrating the precision and capability of the approach. SEM cross-section imaging of solder joints allowed characterization of the extent of melting and growth of interfacial structure. This investigation shows that nanosolder paste can be an effective soldering material to join micro-sized Cu-Cu wires.
||Planned: Supplemental Proceedings volume