|About this Abstract
||2016 TMS Annual Meeting & Exhibition
||Emerging Interconnect and Pb-free Materials for Advanced Packaging Technology
||Electrical Conductivity of Porous Silver Made by Annealing Silver Nanoparticles for Short Periods
||Zuruzi Abu Samah, Kim Shyong Siow
|On-Site Speaker (Planned)
||Zuruzi Abu Samah
Sintered silver is an attractive interconnect material for power electronics where electrical performance is of utmost importance. Silver paste, comprising Ag nanoparticles (np-Ag) in an organic phase, when annealed for short durations at low temperatures often results in porous morphology with sub-micrometer features. Our understanding of electrical conductivity in porous structures hinges on models formulated from macroporous structures in which features range from tens to hundreds of micrometers.
Here, porous morphology of sintered Ag is modelled as a collection of Kelvin cells with cylindrical ligament and spherical vertex (CLSV). The CLSV model is used to predict evolution of electrical conductivity using morphological parameters obtained by high resolution electron microscopy. Electrical conductivity of sintered silver was determined using a 4-point probe technique. Predictions of the CLSV model agree with experimental electrical conductivities of sintered silver annealed at 150 °C between 1 to 5 minutes.
||Planned: A print-only volume