| About this Abstract |
| Meeting |
2010 TMS Annual Meeting & Exhibition
|
| Symposium
|
Pb-Free Solders and Emerging Interconnect and Packaging Technologies
|
| Presentation Title |
Orientation Imaging Studies of Sn3.0Ag0.5Cu Solder Joint with Various Ni Doping after Aging |
| Author(s) |
Tae-Kyu Lee, Kuo-Chuan Liu, Kai-Jheng Wang, Jo-Mei Wang, Chien-Fu Tseng, Jenq-Gong Duh |
| On-Site Speaker (Planned) |
Tae-Kyu Lee |
| Abstract Scope |
SnAgCu solder has been widely used in the electronic package. However, the Sn grain size of SnAgCu solder is easily grown with slow cooling rate and aging. Coefficient of thermal expansion (CTE) along the c-axis of Sn is two times larger than that along a-axis. Larger Sn grain increases CTE mismatch and induces more stress at the grain-boundary region. In this study, the Sn3.0Ag0.5Cu-xNi solder balls were aged at 100 and 150 C for 500 h, respectively. The orientation images of solder balls were acquired by electron backscattered diffraction (EBSD), and correlated with the microstructure and composition evaluated by FE-EPMA. Besides, the Sn3.0Ag0.5Cu-xNi solder ball was jointed with Ni/Au UBM for identifying the substrate effect on the size and orientation of Sn grain. |
| Proceedings Inclusion? |
Planned: Journal of Electronic Materials |