About this Abstract |
Meeting |
6th International Congress on 3D Materials Science (3DMS 2022)
|
Symposium
|
6th International Congress on 3D Materials Science (3DMS 2022)
|
Presentation Title |
Reliable Semiconductor Die Attach Process with Ag/Sn/Ag Sandwich Structure |
Author(s) |
Jinseok Choi, Sung Jin An |
On-Site Speaker (Planned) |
Jinseok Choi |
Abstract Scope |
A low-cost and eco-friendly die attach process for high temperatures should be developed owing to the expansion of the field of high-temperature applications, such as high-power and high-frequency semiconductors. Backside metallization process is typically used to attach a chip to a lead frame for semiconductor packaging because it has excellent bond-line and good electrical and thermal conduction. In particular, the backside metal with the Ag/Sn/Ag sandwich structure has a low-temperature bonding process (235 °C) and a high remelting temperature (above 400 °C) because the interfacial structure composed of intermetallic compounds with higher melting temperature than pure metal layers after die attach process. Here, we introduce a die attach process with a Ag/Sn/Ag sandwich structure to apply commercial semiconductor packages. After the die attachment, we evaluated mechanical and electrical characteristics of the Ag/Sn/Ag sandwich structure and compared to those of a commercial backside metal (Au-12Ge). |
Proceedings Inclusion? |
Definite: Other |