|About this Abstract
||2016 TMS Annual Meeting & Exhibition
||2016 Technical Division Student Poster Competition
||SPG-38: On the Atomistic Mechanism of Solid State Bonding Between Aluminum by Severe Thermal Plastic Deformation: A Molecular Dynamics Study
||Gaoqiang Chen, Zhili Feng, Yucan Zhu, Qingyu Shi
|On-Site Speaker (Planned)
Solid state bonding (SSB) is an important phenomena in a number of metal manufacturing processes, such as friction stir welding (FSW) and porthole die extrusion (PDE). In this study, molecular dynamics (MD) simulation is utilized to investigate the atomistic mechanism of SSB between aluminum surfaces under high strain rate server plastic deformation at various temperatures and pressures. The MD simulation shows that the interfacial bonding fraction is small at the initial contact due to the roughness asperities on the surface. The increase in interfacial bonding fraction is attributed to the severe plastic deformation of the surface asperities, which significantly increases the bonding strength. The severe plastic deformation of asperities generates high density of dislocations and point defects in the vicinity of the bonding interface. These defects move away from the interface in extended hold time, which further increases the bonding strength.
||Definite: None Selected