|About this Abstract
||2018 TMS Annual Meeting & Exhibition
||Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder
||A Study of Ag Alloy Wire with Flash Au after Sulfidation Test
||Yu-Hsien Wu, Fei-Yi Hung, Truan-Sheng Lui
|On-Site Speaker (Planned)
Since the gold price dramatically increase in present year, Ag alloy wire is considered as an alternative material to replace Au wire. However, sulfidation easily occur on Ag surface. Hence, 0.8 mil Ag-2.5Pd-1.5Au alloy wire flash Au (APA2) is selected as the bonding wire material in this study. The purpose of flashing Au process is enhancing the ability of sulfidation resistance. In sulfidation test, we compare APA2 with Ag-2.5Pd-1.5Au alloy wire (APA) to observe the difference of sulfidation resistance. The results shows APA2 remains good sulfidation resistance. And the first bond of APA2 is more stable than APA. Accordingly, APA2 wire can be a potential candidate for wire bonding.
||Planned: Supplemental Proceedings volume