|About this Abstract
||2018 TMS Annual Meeting & Exhibition
||2018 Technical Division Student Poster Competition
||SPG-31: A Mechanism Study of Electromigration Effect:
An In Situ Current Stressing Study
||Yu-chen Liu, Shih-kang Lin
|On-Site Speaker (Planned)
Herein, we employed the in situ scanning electron microscopic (SEM) equipped with electron backscattered diffraction (EBSD), and in situ synchrotron radiation-based X-ray diffraction to study the electromigration (EM) effect. The results show that EM occurs at a critical lattice strain induced by electron flow. Beyond the critical lattice strain, slip is observed as the voids/hillocks formation. Slip to twin deformation transition is found when keeps the lattice strain keeps increasing. Below the critical lattice strain for EM occurrence, only elastic deformation is found. A constitutive model based on the conventional Hooke’s Law is established to calculate the critical lattice strain induced by electron flow for EM occurrence. The calculated result agrees well with the experimental result. The electric current-induced deformation can be discussed in the same context with conventional solid mechanics.