|About this Abstract
||2018 TMS Annual Meeting & Exhibition
||Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XVII
||Interfacial Reaction Studies in SLID Bonding Processes Using Ga and In
||Sinn-wen Chen, Tsu-ching Yang, Ji-min Lin
|On-Site Speaker (Planned)
Thermoelectric modules have attracted very intensive research interests. Although thermoelectric modules are used at relatively high temperatures, the stability temperatures of thermoelectric materials are usually not high. The SLID (solid liquid inter-diffusion) bonding process is a process creates a bond that is stable at higher temperature than the initial processing temperature, and is a promising joining process for thermoelectric modules. Cu is the most commonly used electrode material, and Ni and Co are promising barrier layer materials. The interfacial reactions in the Cu/In/Ni, Cu/In/Co, Cu/Ga/Ni and Cu/Ga/Co samples reacted at 200<sup>o</sup>C, 350<sup>o</sup>C and 500<sup>o</sup>C are examined. Interfacial reaction phases and the In and Ga consumption rates are determined. The average consumption rates of In and Ga in the first hour at 350<sup>o</sup>C in the Cu/In/Ni, Cu/In/Co, Cu/Ga/Ni, Cu/Ga/Co are 63.7, 8.6, 14.5, 22.9 μm, respectively It is observed the reaction phases evolve with reaction time and vary with reaction temperatures.
||Planned: Supplemental Proceedings volume