|About this Abstract
||2017 TMS Annual Meeting & Exhibition
||Emerging Interconnect and Pb-free Materials for Advanced Packaging Technology
||Fabrication and Characterisation of Electroplated Nanotwinned-copper Films on Polymer Substrates
||Liang-Hsien Chang, Chih Chen, Dyi-Chung Hu, Ray Tain, Yu-Hua Chen
|On-Site Speaker (Planned)
Nanotwinned copper (nt-Cu) is drawing wide attention for it simultaneously demonstrates high strength and high ductility, characteristics that are usually thought to be mutually exclusive. Also, according to previous studies, nanotwinned Cu may be the best structure for resisting electromigration damage. In this study, we deposit (111)-oriented nt-Cu on a polymer substrate provided by Unimicron Corporation. CuSO4-based electroplating solution with suitable additives was used in the electroplating process. Direct current was applied to electroplate copper on PCB substrates. Randomly-oriented electroless copper has been deposited on the polymer substrates as the seed layer. Current density and plating bath were as variable. After copper electroplating, XRD, FIB, EBSD were used to understand the detail of the microstructure of the films. We found that the as-deposited Cu has >30% (111)-oriented nt-Cu on the polymer substrate. The microstructures of the highly (111)-oriented nt-Cu will be presented in the conference.
||Planned: Supplemental Proceedings volume