| About this Abstract |
| Meeting |
2010 TMS Annual Meeting & Exhibition
|
| Symposium
|
Pb-Free Solders and Emerging Interconnect and Packaging Technologies
|
| Presentation Title |
Microvoid Formation at Solder-Copper Interfaces during Annealing: A Systematic Study of the Root Cause |
| Author(s) |
Santosh Kumar, Carol A. Handwerker, Joseph Smetana, David Love, James Watkowski, Richard Parker |
| On-Site Speaker (Planned) |
Santosh Kumar |
| Abstract Scope |
The electrodeposition conditions that may contribute to microvoid formation during isothermal aging of Pb-free solder-electrodeposited copper are evaluated in a systematic series of experiments. We first show that the Kirkendall effect alone does not explain the observed microvoids at Cu-Cu<SUB>3</SUB>Sn interface and in Cu<SUB>3</SUB>Sn phase using classic solid-solid diffusion couple experiments. Then, we report the results of 2<SUP>K</SUP> full factorial Design of Experiment to study the effect of pre-screened electroplating parameters such as brighteners, wetting agent, bath age and current density on the propensity of microvoiding at solder-copper interface after annealing at 125 ° C for 40 days. It was found that amount of microvoiding is greatly affected by brighteners, wetting agent, bath age and their interactions. Time of Flight – Secondary Ion Mass Spectroscopy and Glow Discharge Mass Spectroscopy allowed us to establish a correlation between impurities incorporated in copper during electroplating and microvoiding at the solder-copper interface. |
| Proceedings Inclusion? |
Planned: Journal of Electronic Materials |