|About this Abstract
||2016 TMS Annual Meeting & Exhibition
||Emerging Interconnect and Pb-free Materials for Advanced Packaging Technology
||The Intermetallic Compound Formation for the Wire Bond between Al pad and Ag-xPd Alloy Wire
||Wei-hsiang Huang, Kwang-Lung Lin, Yu-Wei Lin, Yun-Kai Cheng
|On-Site Speaker (Planned)
Silver-palladium alloy wire has been shown as an economical and reliable substitute for gold wire in various applications in the electronic packaging industry. The success of wire bonding relies on the formation of interfacial intermetallic compound. This study is aimed to investigate the formation behavior of intermetallic compounds between Al pad and Ag-Pd alloy wire with various Pd contents of 1.0~6.0% for the as bonded commercial Ag/Al joint. The interfacial intermetallic compounds were investigated with scanning electron microscope and energy-dispersive X-ray spectroscopy. The IMCs formed are (Ag, Pd)2Al and (Ag, Pd)3Al2 for Ag6Pd wire while only (Ag, Pd)2Al for the other Ag(1~4.5)Pd alloy wires. The thickness of the total intermetallic compound layer varies from 0.65 um for Ag1Pd to 0.91um for Ag6Pd, yet a minimum of 0.44um exists at Ag2.5Pd. The compound formation behavior was found to correspond with the Ag-Al phase diagram.
||Planned: A print-only volume