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Meeting 2020 TMS Annual Meeting & Exhibition
Symposium Solid State Diffusion Bonding of Metals and Alloys
Presentation Title
Author(s)
On-Site Speaker (Planned)
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Proceedings Inclusion? Planned: Supplemental Proceedings volume

OTHER PAPERS PLANNED FOR THIS SYMPOSIUM

Anisotropic Grain Growth in Cu Joints at Low Temperatures by <111>-oriented Nanotwinned Copper Films
Bulk-state Reaction for Synthesizing Bulk Hybrid Alloys through High-pressure Torsion
Diffusion Bonding of AgC-Cu Bi-Layered Electrical Contacts
Diffusion Bonding of Ti-6Al-4V Alloy to Interstitial Free (IF) Steel Using Copper and Nickel Interlayers
Instant Copper Direct Bonding Using <111>-oriented Nanotwinned Cu Microbumps
Interfacial Recrystallization and Element Diffusion during the Hot Compression-bonding of Ti-6321 to TC4
Mechanical Characterization of Diffusion Bonded Alloy 800H
Mechanical Performance of Diffusion Bonded 316 Stainless Steel for use in a Hybrid Compact Heat Exchanger
Microstructural Characterizations and Mechanical Properties of Diffusion Bonded Stainless Steel 316H and Inconel 800H
Microstructural Evolution and Mechanical Properties of Lap-jointed Ti-6Al-4V Plates by Pin-less Friction Stir Spot Welding
Microstructure Evolution and Mechanical Properties of Diffusion Bonded Ti6Al4V Alloy Joints for Aerospace Applications
Modeling Strength of Diffusion Bonded Interface Using Phase-Field Recrystallization and Creep-Damage Models.
MTI Low Force Friction Welding
Multi-Scale Study Of Bonding Mechanism Between Immiscible Mg/Steel Alloys
O-49: Joining of 14YWT Ferritic ODS Alloys by Spark Plasma Technique
O-50: Optimization and Prediction of Bond Characteristics of Ti6Al4V Diffusion Bonded Joints through RSM
Solid-state Diffusion Bonding of Glass-metal for the International Thermonuclear Experimental Reactor (ITER) Diagnostic Windows
Solid State Joining of Dissimilar Ni-based Superalloys Using Field Assisted Sintering Technology
Tensile Performance of Diffusion Bonded Haynes 230 Alloy for use in a Compact Heat Exchanger
The Role of Interface Microstructure and Chemistry on the Bond Strength of Aluminum 6061 HIP-bonded Samples

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