|About this Abstract
||2017 TMS Annual Meeting & Exhibition
||Phase Transformations and Microstructural Evolution
||F-67: Solidification Microstructures in Ag3Sn-Cu3Sn Pseudo-Binary Alloys
||Haibo Yu, Yu Sun, S. Pamir Alpay, Mark Aindow
|On-Site Speaker (Planned)
Both the intermetallic phases θ-Ag<SUB>3</SUB>Sn and ε1-Cu<SUB>3</SUB>Sn play an important role in microelectronic applications utilizing lead-free solders, where they can be present as minority strengthening phases in the solder alloys and can form as reaction products at solder/substrate interfaces. Studying the properties of these phases is challenging because the phase equilibria make the production of good quality single-phase samples very difficult. Here we present a study on the solidification microstructures in three alloys with Ag<SUB>3</SUB>Sn-Cu<SUB>3</SUB>Sn pseudo-binary compositions to evaluate the extent to which the complex phase equilibria can be avoided. The solidification microstructures have been studied using a combination of X-ray diffraction, electron microscopy, differential scanning calorimetry, and quenching experiments. These data indicate that transformations for these alloys upon heating are consistent with the published ternary phase diagram, however, the solidification microstructures are different from what one would expect on this basis. The consequences of these observations will be discussed.
||Planned: Supplemental Proceedings volume