About this Abstract |
Meeting |
2022 TMS Annual Meeting & Exhibition
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Symposium
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Materials Design and Processing Optimization for Advanced Manufacturing: From Fundamentals to Application
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Presentation Title |
NOW ON DEMAND ONLY: Characterization of the Microstructure and Deformation Substructure
evolution in Additively Manufactured High-entropy Alloys via Correlative EBSD and ECCI
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Author(s) |
Zhangwei Wang, Ji Gu, Lin Guo, Yong Liu, Min Song |
On-Site Speaker (Planned) |
Zhangwei Wang |
Abstract Scope |
We investigate the microstructure and deformation substructure evolution in an additively manufactured N-doped FeCoNiCr high-entropy alloy (HEA) by means of a scanning electron microscopy (SEM)-based approach, which involves correlative electron channeling contrast imaging (ECCI) and electron backscatter diffraction (EBSD) techniques. The combinational use of EBSD and ECCI reveals the microstructure of the additively manufactured HEA across various length scales, including a bimodal grain structure, low angle boundaries, and dislocation networks, along with the quantitative evolution of geometrically necessary dislocations (GNDs) distribution. The deformation microstructure evolution of the HEA upon loading is uncovered to clarify the strain hardening mechanism. The present approach shows comparable resolution to traditional bright field transmission electron microscopy (TEM) imaging, yet with far higher efficiency and affordability. |
Proceedings Inclusion? |
Planned: |