|About this Abstract
||2017 TMS Annual Meeting & Exhibition
||Emerging Interconnect and Pb-free Materials for Advanced Packaging Technology
||The Grain Refinement of Metal Alloy by Electromigration
||PinChu Liang, Kwang-Lung Lin
|On-Site Speaker (Planned)
Previous studies reported that the peak intensity of in-situ synchrotron XRD spectra of solders diminished during electric current stressing. The decline behavior was ascribed to the formation of high dislocation density induced by electromigration force. Grain refining was achieved for pure Sn with appropriate control of the recrystallization behavior triggered by the high density dislocations. The investigation of grain refining by electric current stressing was extended to CuZn brass. The grain refinement can be optimized by monitoring current stressing and Joule heat dissipation. The appropriate control of the current stress-quench cycle parameter reduced the average grain size of the CuZn brass from 15 μm of the annealed as-prepared brass foil to around 4 μm as evidenced by EBSD investigation. The EBSD results show the increase in the fractions of misorientation angles and twin structure, which evidenced the recrystallization of the brass foil, upon the current stress-quench cycle operation.
||Planned: Supplemental Proceedings volume