|About this Abstract
||2017 TMS Annual Meeting & Exhibition
||Characterization of Minerals, Metals, and Materials
||The Influence of Grain Boundaries and Grain Orientations on the Stochastic Responses to Low Load Nanoindentation in Cu
||Benjamin Schuessler, Pui Ching Wo, Hussein Zbib
|On-Site Speaker (Planned)
Mechanical properties in the macro scale are considered to be deterministic, but they have been shown to be stochastic in the sub-micron length scale during nanoindentation. The origin of such stochastic responses is not well understood. The objective of this work is to examine the potential influence of microstructure, in particular grain boundaries and grain orientations, on the stochastic responses in the material during low load nanoindentation. Well-annealed high purity polycrystalline Cu was used in this study. It was found that the pop-in load, displacement excursions at pop-in, hardness and reduced modulus all exhibited different extent of variations. In addition, such stochastic behavior appears to be affected by the grain orientation and the proximity of an indent to a grain boundary. Direct transmission electron microscopy observation of the dislocation structure around nanoindents helps to explain its potential interaction with a grain boundary that may lead to the observed stochastic behavior.
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