| About this Abstract |
| Meeting |
2016 TMS Annual Meeting & Exhibition
|
| Symposium
|
Emerging Interconnect and Pb-free Materials for Advanced Packaging Technology
|
| Presentation Title |
High Temperature Tensile Creep Behavior in Eutectic AuSn Solder |
| Author(s) |
Rupalee P. Mulay, John W. Elmer |
| On-Site Speaker (Planned) |
Rupalee P. Mulay |
| Abstract Scope |
AuSn eutectic composition (Au-20 wt % Sn) is used as a hard solder due to its many attractive properties like high strength, low creep rate, high corrosion resistance and good wetting characteristics. Higher service temperature requirements in many aerospace and automobile applications are putting increasing demands on solder alloys and hence their creep behavior at temperatures greater than 125°C is of interest. The present work examines the tensile creep behavior of AuSn alloys in the temperature range of 125-200°C. Initial results show that the creep rate increases rapidly with stress at temperatures beyond 100°C. Tensile creep samples show large elongations to failure even at temperatures of ~100°C. Possible creep mechanisms and use of AuSn solders at these high temperatures is discussed. |
| Proceedings Inclusion? |
Planned: A print-only volume |