Conventional silicon packaging processes subject entire silicon and package to high temperatures required for Pb-free solder reflow, subjecting the interconnect to undesirable thermal stresses, leading to increased package warpage and reliability constraints. Localized heating of interconnects can help alleviate these stresses by focusing heat only to regions that need to be processed. Localized heating is possible in conductors subjected to AC magnetic fields by Joule heating from induced eddy currents. However, for micro-sized solders used in semiconductor packaging, losses due to eddy currents are negligible and do not contribute significant heating at reasonable AC fields. In this talk, I will introduce a new category of composite materials: magnetic nanoparticle-solder composites and show feasibility of locally melting these composites using relaxation losses in RF fields. Key challenges identified with integrating these composite materials in electronic packages will be described and possible solution paths for research community to pursue will be proposed.