|About this Abstract
||2018 TMS Annual Meeting & Exhibition
||Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder
||Altering the Mechanical Properties of Pb-free Solder Alloys by Alloying with Bi and Sb
||Mehran Maalekian, Mert Çelikin, Karl Seelig
|On-Site Speaker (Planned)
The work reported here evaluates the influence of Bi and Sb contents on the mechanical properties and reliability of Sn-Ag-Cu (SAC) solders. The effects of Bi and Sb on creep resistance and strength of Pb-free alloys are discussed based on the experimental results. It is demonstrated that addition of Bi and Sb in SAC solder play different roles in stabilizing the microstructure and mitigating aging effect on microstructural changes. It is shown that antimony in solution has a minor impact on the strength, whereas the addition of bismuth has a much more pronounced strengthening effect. Due to the different impact on the reliability and overall performance of a solder joint, the contribution of Bi and Sb in a solder alloy need to be well engineered.
||Planned: Supplemental Proceedings volume