|About this Abstract
||2016 TMS Annual Meeting & Exhibition
||Characterization of Minerals, Metals, and Materials
||LL-64: Characterization Methodologies for Investigating Surface Integrity in Microelectronics Packaging
||Marion Branch Kelly, Bethany B Smith, Cruz Hernandez, Kimberly McGuinness, Amaneh Tasooji
|On-Site Speaker (Planned)
||Marion Branch Kelly
The transition to lead-free solder in microelectronics packaging (MEP) has benefitted the environment in many ways. However, with new materials systems come new materials issues and requirements. Protective surface treatments such as Organic Surface Preservatives (OSP) are used to prevent copper pads from oxidizing during MEP processing. Characterizing the copper oxidation underneath the surface treatment is challenging but necessary to ensure product integrity. Focused Ion Beam Scanning Electron Microscopy (FIB-SEM), which is a costly and time-consuming method (that is not viable below ~100nm oxide thickness), is often used to determine the extent of copper oxidation and the effectiveness of the surface treatment.
The applicability of more cost-effective and efficient characterization methodologies such as Quartz Crystal Microbalance (QCM) and Sequential Electrochemical Reduction Analysis (SERA) in quantifying copper pad oxidation were investigated in this study.
The effectiveness of QCM and SERA was validated with FIB-SEM oxide thickness measurements. FIB-SEM data were also used to calibrate the analytical model created from raw QCM data. The proposed methodologies result in an orders of magnitude reduction in characterization cost and time.
||Planned: A print-only volume