|About this Abstract
||2016 TMS Annual Meeting & Exhibition
||Emerging Interconnect and Pb-free Materials for Advanced Packaging Technology
||Investigation of Anisotropic Micromechanical Behaviors of Cu6Sn5 by In-Situ Micropillar Compression
||Jui-Yang Wu, J. J. Yu, L. J. Yu, C. R. Kao
|On-Site Speaker (Planned)
The micromechanical behaviors of single-crystalline Cu6Sn5 are measured by using the micropillar compression testing and nanoindentation. The micropillars are fabricated by using focused ion beam machining. They are then compressed by picoindenter in SEM, where in-situ observation can be carried out. In addition, the anisotropy in mechanical properties of Cu6Sn5 is studied based on orientation image mapping using electron backscattered diffraction (EBSD).
||Planned: A print-only volume