|About this Abstract
||2016 TMS Annual Meeting & Exhibition
||Late News Posters
||PP-2: A Novel Approach to Synthesize Cu-Ni-Al Thin Films by Electrodeposition with Potential Shape Memory Properties
||Jordina Fornell, Doga Bilican, Pau Solsona, Santiago Suriņach, Dolors Barķ, Eva Pellicer, Jordi Sort
|On-Site Speaker (Planned)
To obtain low cost Cu-based shape memory alloys at sizes appropriate for MEMS applications, produced in a cost/time-effective manner, micrometre thick Cu-Ni thin films were grown by electrodeposition. They were subsequently annealed, and quenched in iced water. Firstly, silicon (100) substrates were annealed at 1000ēC in open air to obtain a silicon oxide layer that acts as a diffusion barrier. Prior to sputtering of a 250 nm thick aluminium layer, a 10 nm titanium adherence layer was sputtered onto the substrate. Followingly, Cu-Ni films were electrodeposited onto Al from an environmentally friendly sulphate electrolytic bath. The current density and time were properly tuned to co-deposit the desired Cu and Ni contents targeting at shape memory compositions. Finally, annealing and quenching at 900oC for 1 hour was carried out to allow aluminium diffusion and beta-phase formation. The obtained alloys were structurally characterized and the thermomechanical properties investigated.