|About this Abstract
||2016 TMS Annual Meeting & Exhibition
||Emerging Interconnect and Pb-free Materials for Advanced Packaging Technology
||Reliability of Die Attach Using Ag Nanoporous Sheet for High Temperature Electronics
||Min-Su Kim, Hiroshi Nishikawa
|On-Site Speaker (Planned)
Ag nanoparticle sintering have received attention as a alternative joining method of lead-based soldering, but there are still some problems, such as difficulty of control of joining layer thickness and occurrence of unexpected voids related with evaporation of solvent. In previous research, we suggested the Ag nanoporous bonding (NPB) as a die-attach joining method for the high temperature electronics using Ag nanoporous sheet. Here, we investigated the long term reliability of Ag NPB joint through thermal storage (TS) and temperature cycling (TC) tests. NPB process was conducted at 300 °C with an applied pressure of 20 MPa for 30 min. The TS at 250 °C up to 1000 h and TC from -55 °C to 150 °C up to 1500 cycles on the Ag nanoporous bonding joint were conducted. Microstructural change, interfacial reaction, and fracture behavior of Ag NPB joints after TS and TC were also investigated.
||Planned: A print-only volume