|About this Abstract
||2017 TMS Annual Meeting & Exhibition
||Mechanical and Creep Behavior of Advanced Materials: A SMD Symposium Honoring Prof. K. Linga Murty
||Effect of Thermo-mechanical History on the Creep Behavior of Sn-Ag-Cu Solders
||Babak Talebanpour, Indranath Dutta
|On-Site Speaker (Planned)
Solder joints experience cyclic strains and high homologous temperatures during service. This alters the microstructure, and influences the creep response, affecting the reliability of microelectronic packages. Here, the microstructure and the resultant impression creep behavior of Sn-3.0Ag-0.5Cu and Sn-1.0Ag-0.5Cu solders, subjected to various thermo-mechanical cycling and isothermal aging processes, are correlated. The creep rate was found to be proportional to the Ag3Sn particle size in the eutectic for Sn-3.0Ag-0.5Cu, the microstructure of which contains a continuous network of eutectic surrounding proeutectic β grains. In Sn-1.0Ag-0.5Cu, where the eutectic is not continuous, the proeutectic contributes significantly to the creep response. The results are utilized to develop a generalized composite creep model, which shows that the creep rate increases linearly with precipitate size for solders with high eutectic volume fraction, but at a less-than-linear rate for solders with low eutectic volume fraction (i.e., discontinuous eutectic). Supported by SERDP (W912HQ-10-C-0041) and SRC (2008-KJ-1855).
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