|About this Abstract
||2018 TMS Annual Meeting & Exhibition
||Ultrafine-grained Materials X
||High-pressure Torsion of Copper-molybdenum Composites
||Julian Rosalie, Zaoli Zhang, Reinhard Pippan
|On-Site Speaker (Planned)
Copper-refractory composites are used in high-performance applications requiring dimensional stability and high thermal and/or electrical conductivity. Nanostructured forms of such composites, for example accumulative roll-bonded Cu-Nb sheets, also offer high mechanical strength and exceptional thermal stability against coarsening.
Molybdenum composites offer higher thermal and electrical conductivity and lower coefficients of thermal expansion than the equivalent group VI (Nb, Ta) materials. However forming nanostructured composites is difficult due to the brittleness of Mo and the need to strike a balance between ensuring sufficient ductility and minimising dynamic grain growth.
In this work, Cu-Mo composites were severely plastically deformed via room-temperature high-presssure torsion to produce fully-dense nanostructured composites. This process was capable of producing lamellar composites with Mo layer thickness of 10-20 nm. The microstructure of the nanostructured composites was examined using transmission electron microscopy to measure the layer thickness, grain size and extent of forced mixing.
||Planned: Supplemental Proceedings volume