|About this Abstract
||The 7th Pacific Rim International Conference on Advanced Materials and Processing (PRICM 7)
||Symposium G: Thin Films and Surface Engineering
||Microscopic Study on the Interface Reaction between Ti and Al-Zn Alloy during Ultra-Fast Heat Treatment
||Yue Zhao, David Nolan, David Wexler, Andrew Carman
|On-Site Speaker (Planned)
A new experimental routine is designed to investigate the reaction/diffusion behaviour between Ti and 55%AlZn alloy. In this method, we employ physical vapour deposition (PVD) to coat polished, pre-homogenized Al-Zn discs. The resultant sample is subsequently subjected to a high heating rate, high cooling rate heat-treatment. TEM study shows that Ti is relatively stable with AlZn, comparing with Si-AlZn system. Ti start to dissolve into AlZn after 560°C 10 sec Gleeble heat treatment. The 500 nm Ti film still exists after 600°C 30 sec heat treatment with 5 min heating up process (image c). When temperature increases to 700°C, Ti dissolves into AlZn rapidly. No separate Ti film is observed after 700°C 10 sec Gleeble heat treatment. The results are useful in process optimization in applications of AlZn coatings.