|About this Abstract
||2018 TMS Annual Meeting & Exhibition
||High Entropy Alloys VI
||Intermetallic Compound Enhances Twinning and Strength in a Duplex High Entropy Alloy
||Deep Choudhuri, Bharat Gwalani, Mageshwari Komarasamy, Sinivas Aditya Mantri, Rajiv S Mishra, Rajarshi Banerjee
|On-Site Speaker (Planned)
A “duplex” microstructure was engineered in a normally single fcc phase high entropy alloy (HEA), comprising of a high volume fraction of IMC embedded within soft fcc grains, exhibiting a remarkable combination of room-temperature ductility, and strength approaching that of commercial titanium alloys. This novel microstructure was produced by conventional processing routes, i.e. cold-rolling and annealing, that takes advantage of the thermodynamically metastable nature of HEAs, and unique phase combinations afforded by their equiatomic composition. The local stress introduced by the IMCs during plastic deformation enhances strain-hardening and plasticity by promoting extensive deformation-twinning within the fine grained fcc matrix – contrary to single phase alloys. The observed twinning modes are expected to improve damage tolerance in structural materials where excessive local stresses lead to failure of parts.
||Planned: Supplemental Proceedings volume