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Meeting Materials Science & Technology 2019
Symposium Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder
Presentation Title Corrosion Behavior of Electroplated and Electroless Plating Ni/Pd/Au Surface Finish on Automobile Printed Circuit Board
Author(s) Albert T. Wu, Yi Ting Shen, Chih Yuan Hsiao, Freeze Wang, Nico Li
On-Site Speaker (Planned) Albert T. Wu
Abstract Scope Corrosion is a serious reliability concern for electronic products. In this study, corrosion resistance of electroplating Ni/Pd/Au is compared with electroless Ni/Pd/Au (ENEPIG) surface finishes, and both of them are plated on Cu pad in automobile printed circuit board (PCB). The samples coated with different surface finishing layers were placed in a chamber of 100% RH (relative humidity) and an ambient of 15 ppm, 150 ppm and1500 ppm of SO2. After the corrosion test, the morphology of corrosion products formed on the surface were observed by scanning electron microscopy (SEM), and the elements of corrosion products were analyzed by energy dispersive X-ray spectroscopy (EDS). Grazing incident X-ray diffraction (GIXRD) was applied to characterize the crystal structure of the corrosion products. The results reveal that the electroplating Ni/Pd/Au has better corrosion resistance than the EPENIG. A mechanism is proposed to discuss the corrosion behaviors for the surface finishes.
Proceedings Inclusion? Definite: At-meeting proceedings

OTHER PAPERS PLANNED FOR THIS SYMPOSIUM

A Model Study of Microstructure Evolution and Bi Diffusion in Sn-Bi Low Temperature Soldering Systems
Corrosion Behavior of Electroplated and Electroless Plating Ni/Pd/Au Surface Finish on Automobile Printed Circuit Board
Effect of Reducing Agent on the Joint Strength of Sintered-joint with Cu Paste
Effect of Thermal Annealing on Structural Integrity of Cu-filled-through Si Via (TSV)
Fabrication of Stress Free Ni-Co Coatings Using Electroplating Method
Heated Mechanical Cycling as a Substitute for Thermal Cycling - A Preliminary Investigation for a New Failure Analysis Technique
IMC Evolution as a Function of Grain Orientation under High Current Density in Sn-based Solder Joints
Instability Detection in Press-fit Connector Pin Interconnects after Thermo-mechanical Cycling
Interfacial Reactions in Co/Ag-Cu, Ni/Ag-Cu, Co/Ag-Sb and Ni/Ag-Sb Couples
Micro Interconnect Mechanical Stability in Cryogenic Temperature Environment
Micro Interconnect Shear and Creep Performance under Current Stressing
Microstructure Evolution in Cu and Ag Coated Cu Particle Sintering for Power Module Interconnection
Predicting Electromigration-mediated Damage in Interconnects Using Phase-Field Models
Stretchable Joint with Ag-PDMS for Wearable Electronics
Understanding Reliability Failure Mechanisms in Pb Free Solder Joint with Micro-gap Configuration

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