|About this Abstract
||2016 TMS Annual Meeting & Exhibition
||2016 Technical Division Student Poster Competition
||SPG-16: Morphology and Microstructure of Ag Alloy Wire for Electronic Packaging under Electromigration
||Jui-Nung Wang, Tzu-Yu Hsu, Fan-Yi Ouyang
|On-Site Speaker (Planned)
Since Ag alloy wire is a potential candidate for the electronic packaging industry, the reliability of Ag alloy wire becomes a crucial issue. This study investigates on the morphology and microstructure of Ag alloy wire bonded on Al metallization pad under electromigration test with current density of 8x10^4 A/cm^2at 150 oC. The results show the polarity effect: different morphologies of Ag alloy wire were observed near bonded interface with different direction of the electron flow. The protrusions emerged on the surface of the ball bonds when electrons flow from Al pad to the Ag wire whereas no significant morphology change of wire was observed when electron flow was reversed. In addition, significant grain growth accompanying with twin formation was found when electrons flow from pad to the wire. The corresponding mechanism of different morphology of wire would be discussed.
||Definite: None Selected