| About this Abstract |
| Meeting |
2010 TMS Annual Meeting & Exhibition
|
| Symposium
|
Pb-Free Solders and Emerging Interconnect and Packaging Technologies
|
| Presentation Title |
Effects of POSS on Impact Behavior of Thermomechanically Fatigued Lead-Free Solder Joints |
| Author(s) |
Takayuki Kobayashi, Andre Lee, K.N. Subramanian |
| On-Site Speaker (Planned) |
Takayuki Kobayashi |
| Abstract Scope |
Polyhedral oligomeric silsesquioxanes (POSS) addition to lead-free electronic solders have shown to considerably increase the residual shear strength and reliability of thermomechanically fatigued solder joints. In this study, impact tests on joints made with SAC305 and SAC105 solders, with and without POSS, were carried out. Realistic studies to evaluate the reliability of electronic devices after impact should be carried out after they have experienced different extents of thermal influences during service. Hence, impact studies on these solder joints were performed after subjecting them to different extents of thermomechanical fatigue (TMF) in (-15ºC to 150ºC), and (-55ºC to 125ºC) temperature ranges. Roles of the microstructural features and IMC morphologies that result from the imposed TMF treatments and their influences on the impact responses of SAC305 and SAC105 solder joints, with and without POSS, will be discussed. |
| Proceedings Inclusion? |
Planned: Journal of Electronic Materials |