|About this Abstract
||2016 TMS Annual Meeting & Exhibition
||Phase Transformations and Microstructural Evolution
||In-situ SEM Observation of Surface Diffusion and Intermetallic Compound Growth in Lead-free Solder Joints
||Yang Li, Choong Un Kim, Minyoung Kim
|On-Site Speaker (Planned)
Experimental and theoretical studies on interface reaction and resulting evolution of microstructure in Pb-free solder joint have been extensive because it is known to impart key influence on joint reliability. While such studies are instrumental in providing underlying mechanisms behind the reaction, they are still insufficient to yield exact sequence of events occurring at the joint with high resolution, sufficient to apply them to the analysis of the reaction in extremely small joint geometry such as the microbump. In order to overcome such limitation, in-situ reaction studies are conducted on small scale Pb-free solder joint in SEM and tracked the evolution of joint microstructure, including the consumption pattern of Sn and the growth of intermetallic (IMC) phases. This paper presents highlighting results of our studies with weighted emphasis on the reaction carried out by the surface reaction and evolution of voiding in Sn as well as in the IMC phases.
||Planned: A print-only volume