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Meeting 2018 TMS Annual Meeting & Exhibition
Symposium Fracture: 65 Years after the Weibull Distribution and the Williams Singularity
Presentation Title Applicability of Weibull Statistics for Micro- and Nano-scale Silicon Components
Author(s) Frank W DelRio, Robert F Cook, Brad L Boyce
On-Site Speaker (Planned) Frank W DelRio
Abstract Scope Silicon devices are ubiquitous in many micro- and nano-scale technological applications, most notably microelectronics and microelectromechanical systems. Despite their widespread usage, however, uncertain mechanical reliability remains a major factor inhibiting the further advancement of device commercialization. In particular, reliability issues related to the fracture of small-scale components have become increasingly important given continued reductions in critical feature sizes coupled with escalations in device actuation forces and harsh usage conditions. The Weibull probability distribution has frequently been used to make such reliability assessments. In this talk, we review several case studies on the fracture strength of micro- and nano-scale silicon components and discuss the applicability of the Weibull probability distribution on such components from statistical, materials, and engineering viewpoints. Two key points are addressed: (1) the importance of including a threshold strength in the probability distribution and (2) the significance of the strength measurement sensitivity to variability in the component.
Proceedings Inclusion? Planned: Supplemental Proceedings volume

OTHER PAPERS PLANNED FOR THIS SYMPOSIUM

A Data-driven Approach to Predict Microstructurally Small Crack Evolution
A Probability Model for Stress Rupture Failure of Carbon Composites, Incorporating Weibull Fiber Strength Statistics, Local Fiber Load Sharing, and Matrix Creep
An Integrity Basis of Fracture Challenges
Applicability of Weibull Statistics for Micro- and Nano-scale Silicon Components
Comparison of Methods to Find the Weibull Stress Parameters
Composite Overwrapped Pressure Vessel (COPV) Life Test
Computational Procedure for Designing New Gen 3 Steels with High Formability and Ductile Fracture Resistance
Forward Propagation of Random Microstructural Features for Reliability Estimates of Engineering Structures
Fracture Behavior of High Performance Sheet Steel
Fracture Toughness of Silicon by Variable Temperature Micropillar Splitting
Grain and Sub-grain Level Strains ahead of an Evolving Fatigue Short Crack as Measured by X-ray Techniques
High Temperature Cracking Damage of Calcium Aluminate Cements
K-dominance of Atomistic Cracks
Limitations and Applicability of LEFM to Spalling Fracture in Single Crystal Semiconductors
NASA's Plan for Development and Transition of Computational Materials-based Capabilities for Next-generation Durability / Damage Tolerance and Additive Manufacturing
On the Experimental Evaluation of the Fracture Toughness of Shape Memory Alloys
On the Prediction of Failure in 6016 Aluminum Alloy Sheet by GISSMO Damage Model
Physical and Computational Aspects of Engineering Damage Mechanics
Predicting Joint Strength: Evaluating Interface Corner Stress Intensity Factor and Cohesive Zone Modeling Approaches
Re-tooling the Engineering Predictive Practices for Durability and Damage Tolerance
Singularities of Dynamic Cracks
Size, Temperature, Environmental Effects on Brittle Fracture (BDT)
The Complexity of Ductile Fracture
The Effect of Loading Rate on Fracture Toughness of Low Ductility Materials
Toughness, Roughness and Crack Path Engineering for Improved Ductile Fracture Resistance
Trends in Microstructure-sensitive Computational Approaches to Fatigue Cracking
Use of Weibull Distribution to Characterize High Performance Fibers
Using R-curves to Predict Fatigue Behavior in Crack Bridging Toughened Ceramics
Void Initiation during Ductile Rupture of Pure Metals
Weibull Analysis of High Strength Ni- and Fe-based Bulk Metallic Glasses

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