About this Abstract |
Meeting |
MS&T22: Materials Science & Technology
|
Symposium
|
Additive Manufacturing of Metals: Microstructure, Properties and Alloy Development
|
Presentation Title |
Post-process Heat Treatment Effects on Additive Manufactured Pure Copper |
Author(s) |
Wanxuan Teng, Biao Cai, Kenneth Nai, Stuart Jackson, Ian Campbell |
On-Site Speaker (Planned) |
Wanxuan Teng |
Abstract Scope |
Pure copper is highly desirable as a material for making heat exchangers, cooler and electrical components due to its good thermal and electrical properties. However, laser sintering of copper powder with an Infra-Red laser with a wavelength of 1070nm is a challenge because copper is highly reflective at that wavelength, only a few percent of the laser energy is absorbed into the powder to cause it to melt. The high thermal conductivity of copper and high laser energy required cause the melting process to be unstable and often results in poor electrical, thermal and mechanical properties of the finished parts. Post-print heat treatments were applied to optimize the thermal and electrical conductivity, achieving 374 W/mK and 99.5% IACS after 1000 °C/2 h annealing. The underlying mechanisms for the improvement of thermal and electrical conductivity were discussed based on microstructure characterization. |