|About this Abstract
||2016 TMS Annual Meeting & Exhibition
||Emerging Interconnect and Pb-free Materials for Advanced Packaging Technology
||On the Evolution of the Nanoporous Microstructure of Sintered Ag during Ageing
||Wei Mao, James Carr, Loic Signor, Carole Nadot-Martin, Azdine Nait-Ali, Pascal Gadaud, Marc Legros, Xavier Milhet
|On-Site Speaker (Planned)
Ag paste sintering is a promising solution for replacing high temperature pb-solder in power electronics. Knowing the evolution of its porous microstructure during thermal aging is of the utmost importance in order to predict its mechanical behavior in-service.
The evolution of the porosity during ageing at high temperature was investigated using 3D reconstructions obtained by tomography at the nanometric scale. Segmentation of the porosity and subsequent statistical analysis (covariance analysis) of the tomographic dataset reveal pore shape, size and spatial distributions. Such analysis provides insight into the microstructural evolution of sintered nanoporous Ag joints due to thermal aging. Additionally, segmented image datasets are used to produce image-based finite element model used to investigate the properties.
||Planned: A print-only volume