About this Abstract |
Meeting |
2022 TMS Annual Meeting & Exhibition
|
Symposium
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Alloys and Compounds for Thermoelectric and Solar Cell Applications X
|
Presentation Title |
High-throughput Transport Property Measurements of Additively Manufactured Thermoelectric Materials |
Author(s) |
Dylan Kirsch, Vijayabarathi Ponnambalam, Joshua Martin, Connor Headley, Saniya LeBlanc, Prasanna Balachandran, Ji Ma |
On-Site Speaker (Planned) |
Dylan Kirsch |
Abstract Scope |
Widespread adoption of thermoelectric (TE) energy conversion technology has been hindered by low conversion efficiency and high device production costs. In contrast to traditional TE device manufacturing methods, powder-bed additive manufacturing (AM) is now being explored to print components with unique and controllable geometries, with the potential to reduce assembly steps, material waste, and production time and costs. A primary challenge of AM TE materials is the optimization of the processing parameters that affect the solidification microstructure and thereby the macroscale transport properties. To elucidate these processing-structure-property relationships, we synthesized material libraries that contain discrete processing parameters and subsequently performed high-throughput transport measurements on each region. We will present high-throughput electrical resistance and Seebeck coefficient measurements, along with bulk heat capacity and diffusivity measurements. We will emphasize key insights into processing-structure-property relationships that enable the tuning of AM parameters for producing higher efficiency and lower cost TE devices. |
Proceedings Inclusion? |
Planned: |
Keywords |
Additive Manufacturing, Other, Other |