|About this Abstract
||2017 TMS Annual Meeting & Exhibition
||Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XVI
||Interfacial Characterizations of an Electroless Nickel Layer on a Polyimide Film
||Pei-Yu Wu, Chih-Ming Chen
|On-Site Speaker (Planned)
Polyimide (PI) is promising as the substrate in the application of portable and flexible electronic products due to superior thermal stability and chemical resistance. Metallization of Ni on a polyimide film through surface modification and chemical deposition has been successfully developed in which the Ni nanoparticles formed in an potassium salts of poly(amic acid) (PAA) sublayer were used as the catalyst for electroless deposition of Ni. For high frequency application, the interfacial characterizations of a Ni layer on a PI film need more attention. In this study, the stability of Ni at the Ni/PI interface and in the PAA sublayer was investigated by heating the Ni/PI samples at 260 oC and 200 oC to simulate the reflow and thermal aging conditions, respectively. Transmission electron microscopy (TEM) and X-ray photoelectron spectrometry (XPS) were used to examine the atomic diffusion behavior of Ni at the Ni/PI interface.
||Planned: Supplemental Proceedings volume