|About this Abstract
||2017 TMS Annual Meeting & Exhibition
||Computational Thermodynamics and Kinetics
||Joint Formation and Microstructural Evolution in the Microbumps of Three Dimensional Integrated Circuits (3DICs)
||Vahid Attari, Raymundo Arroyave
|On-Site Speaker (Planned)
It is been a while that microelectronic industry has replaced Al based on-chip conductors with Cu based ones and Cu-Sn-Cu micro-joints are used widely in the current 3DIC architecture. While, miniaturization and microstructural effects are still source of reliability concerns, the electromigration induced failure treats the design of 3DICs. In this work, multi-phase field modeling is utilized to study the process of joint formation during isothermal solidification in these joints. Heterogeneous nucleation and evolution of Cu6Sn5 and Cu3Sn interfacial intermetallics are modeled by considering the thermodynamics and kinetics of Cu-Sn reacting system at 260, 300 and 340°C. Experimental observations are considered in the development of the computational model and the values of the grain boundary and interfacial diffusion regimes are optimized. This study paves the way for further investigation of the microstructural evolution due to simultaneous chemical and electromechanical interactions to optimize the desired microstructure for in-service conditions.
||Planned: Supplemental Proceedings volume