The majority of MEMS devices still rely on silicon, however, future applications will be expanded greatly if they can be used in extreme environments, especially at elevated temperatures. These applications require advance materials with high strength, density, electrical conductivity, dimensional stability, and microscale manufacturability, but MEMS materials with this suite of properties are currently unavailable. In the present study, we sputter deposited a compositional spread of single-phase solid solution nickel-molybdenum-tungsten alloy films revealing exceptional thermal-mechanical stability due to the presence of nanotwins and stacking faults. Experimentally capturing the effects of chemical composition as a function of microstructure, CTE, and the mechanical and electrical properties has enabled down selection for the most promising alloys. Freestanding micro-cantilever arrays were deposited, etched, and shaped to demonstrate dimensional control over a range of compositions. Residual stresses and stress gradients were measured to determine the applicability of these films for next generation metal MEMS devices.