|About this Abstract
||2016 TMS Annual Meeting & Exhibition
||Emerging Interconnect and Pb-free Materials for Advanced Packaging Technology
||Failure Morphology of Lead-free Sn-3.0Ag-0.5Cu Solder Joint under Low-G Drop Impact
||Jian Gu, Yongping Lei, Jian Lin, Hanguang Fu, Zhongwei Wu
|On-Site Speaker (Planned)
The miniaturization of products with the multiple functions result in the increase of package density. So the reliability of solder become a hotspot during usage process. Traditionally, the study direction are mainly focus on the thermal, electronic, magnetic. However, the damage of thermal cycle or shock, electromigration, creep need long time. With the portable electronic product replacement speed up, the failure of solder joint caused by the vibration or drop impact during usage or transport process which become major problem. The recently work indicated that the brittle fracture of lead free (Sn-Ag-Cu) solder joint IMC layer is a major failure mode under high G drop impact (≥1000g). However, little work focus on the low-G drop impact, which lead the decrease of deflection, strain, push and pull stress immediately. So, the failure mode of lead free joint under low-G drop impact will be analyzed in this study.
||Planned: A print-only volume