|About this Abstract
||2017 TMS Annual Meeting & Exhibition
||Emerging Interconnect and Pb-free Materials for Advanced Packaging Technology
||Electrical and Mechanical Properties of Sn-Ag-Cu Solder Pastes for Reverse-offset Printing Depending on Particle Concentration
||Min-jung Son, Minwoo Kim, Taik-Min Lee, Hoo-Jeong Lee, Inyoung Kim
|On-Site Speaker (Planned)
Nowadays, various printing techniques far surpassing the limitation of stencil printing are receiving a lot of attention in semiconductor packaging industry. Among them, reverse-offset printing has shown a high printing resolution of 1~3 μ m and smooth film surfaces for Ag nanoparticle inks. To apply the reverse-offset printing to a flip chip packaging, we fabricated Sn-Ag-Cu solder pastes consisting of flux medium and solder particles. The viscoelastic property for printability was controlled by changing the particle concentration without additional additives. After 2-step-reflow treatment, electrical and mechanical properties of solder bumps depended on the particle concentration. Soldering behaviors of the pastes, their microstructural development and organic residue were analyzed to explain the change of electrical and mechanical properties depending on the particle concentration. As a result, the solder paste with a particle concentration of 85 wt% represented a resistance and a shear strength of 0.5 Ω and 5.9 MPa, respectively.
||Planned: Supplemental Proceedings volume