|About this Abstract
||Materials Science & Technology 2011
||MS&T'11 Poster Session
||253 Real-Time Observation of Soldering of Solder Balls Using SEM-WELDER
||Jeng-O Kim, Jeong Suh, Hee Shin Kang, Jae-Pil Jung
|On-Site Speaker (Planned)
To in case of the welding on the powder of nano-grade and tiny electronic components. It's also modified to get the real time observation on the melting processing of welding target. Finally we've reached the conclusion via the basic experiments. The conclusions are as follows: 1) To use the Scanning Electron Microscope (SEM) for materials processing, we've modified the construction of the resonator so that Ib (Beam current) has increased from tens of ㎀ to 35㎂; 2) We've observed melting processing on Solder Ball by using BSE (Back scattered Electron Detector) in realtime; 3) We've checked the weldability for the materials of high melting point from the melting experiment of Cu Wire and confirmed the possibility.