|About this Abstract
||2016 TMS Annual Meeting & Exhibition
||Emerging Interconnect and Pb-free Materials for Advanced Packaging Technology
||Electrochemical Migration of Fine Pitch Ag Interconnects
||Chia-Hung Tsou, Heng-Tien Lin, Fan-Yi Ouyang
|On-Site Speaker (Planned)
With development of Intelligent electronic products, usage of fine pitch interconnect became mainstream in high performance electronic devices. Electrochemical migration (ECM) would be a serious problem in fine pitch scale interconnects under temperature, humidity and biased voltage. In this study, ECM behavior was evaluated by thermal humidity bias (THB) and water drop (WD) test through in-situ voltage versus time (VVT) curve to observe the failure of samples on glass substrate. Samples with different pitch sizes, ranging from 20 um to 50 um, were also investigated. In water drop test, samples were tested by drops of deionized water and solution with chloride. Different failure modes were found resulting from the various solution. The ECM performance between WD and THB tests would be compared, corresponding failure mechanism and ECM acceleraton model from THB test would be discussed.
||Planned: A print-only volume