|About this Abstract
||2016 TMS Annual Meeting & Exhibition
||Emerging Interconnect and Pb-free Materials for Advanced Packaging Technology
||Effect of Crystal Orientation and Microstructure on the Nucleation and Growth of Tin (Sn) hillocks by In Situ Nanoindentation and Electron Backscattered Diffraction (EBSD)
||Irene Lujan-Regalado, Antony Kirubanandham, Carl Mayer, Sudhanshu S Singh, Jason J Williams,
|On-Site Speaker (Planned)
For years tin whiskers have been a serious problem in microelectronic products. In this work, the growth of mechanically induced tin whiskers/hillocks was studied. A dedicated Scanning Electron Microscope (SEM) with an in situ Nanoindenter and an Electron Backscatter Diffraction (EBSD) detector was used to indent, characterize, and monitor the nucleation and growth of tin whiskers/hillocks on electroplated samples. The grain orientation of the hillocks and the plastically deformed area surrounding the indent was studied on slabs lifted out of the sample with the aid of Focused Ion Beam (FIB). The correlation between the presence of intermetallic compound (IMC) and hillock formation was studied. The changes in the grain structure, hillock morphology and distribution and any preferential growth orientation of the tin hillocks will be discussed.
||Planned: A print-only volume