|About this Abstract
||2017 TMS Annual Meeting & Exhibition
||Mechanical Behavior of Nanostructured Materials
||Grain Size or Film Thickness? Influence of the Two Main Length Scale Parameters on the Mechanical Reliability of Polymer-supported Metal Films
||Oleksandr Glushko, Megan Cordill
|On-Site Speaker (Planned)
In this presentation the relationship between grain size, film thickness and mechanical damage induced by monotonic and cyclic tensile loading in Cu and Au films will be analyzed. For in-situ monitoring of microstructural and topological changes the electric resistance signal measured during the mechanical tests was utilized. The SEM and EBSD were used for direct characterization of mechanical damage and possible changes in the microstructure. It will be shown that restricted ductility due to small grain size acts as a drawback in monotonic tensile test but provides a significant advantage during cyclic loading. Thicker films with larger grain size can be strained to higher strains without extensive cracking but fail at much lower cyclic strains due to the formation of extrusion/crack couples. The maximum density of cracks induced by cyclic loading is predominantly defined by the film thickness and does not depend on the grain size.
||Planned: Supplemental Proceedings volume