|About this Abstract
||2017 TMS Annual Meeting & Exhibition
||Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XVI
||Transient Liquid Phase Bonding of Cu/In/Ni and Cu/In/Co and Phase Equilibria of Cu-In-Ni and Co-Cu-In Ternary Systems
||Sinn-Wen Chen, Tsu-Ching Yang, Ji-Min Lin
|On-Site Speaker (Planned)
Improvement of energy usage efficiency via waste heat recovery using thermoelectric modules is a very important topic. Thermoelectric modules are usually composed of arrays of devices, and there are thus many joints in the modules. Indium is ductile and has a low melting point. Transient liquid phase bonding using indium is a potential joining technique for thermoelectric modules which cannot be joined at very high temperatures but need to be operated at relatively high temperatures. The interfacial reactions at the Cu/In/Co and Cu/In/Ni contacts are examined at 200<SUP>o</SUP>C and 350<SUP>o</SUP>C. At the Cu/In contact, Cu<SUB>11</SUB>In<SUB>9</SUB> phase is formed when reacted for 24 hours at 200<SUP>o</SUP>C, but Cu<SUB>2</SUB>In and Cu<SUB>7</SUB>In<SUB>3</SUB> phases were formed at 350<SUP>o</SUP>C. A ternary compound is also noticed. Only CoIn<SUB>3</SUB> is formed at the In/Co contact at both 200<SUP>o</SUP>C and 350<SUP>o</SUP>C. The reaction paths are illustrated using the Co-Cu-In and Cu-In-Ni isothermal sections at both 200<SUP>o</SUP>C and 350<SUP>o</SUP>C.
||Planned: Supplemental Proceedings volume