|About this Abstract
||2016 TMS Annual Meeting & Exhibition
||Recent Advancement on Stretchable and Wearable Electronics
||Materials Integration for Flexible Electronics: Cu-interconnects, Supercapacitors
||Tolga Aytug, Pooran Joshi, Matthew S. Rager
|On-Site Speaker (Planned)
We present photo-thermochemical processing of inkjet-printed CuO nanoparticles for efficient fabrication of Cu electrodes as a cost-effective alternative to complex lithographic techniques for large-scale fabrication of flexible electronic devices. Pulse-thermal processing (PTP) technique was used to reduce CuO to Cu and subsequently sinter the Cu nanoparticles on flexible, silica-coated PET substrates. The effects of PTP on print conductivity and mechanical stability were studied as a function of pulse intensity, number of pulses and pulse duration. Supercapacitors combining the synergic advantages of improved electrochemical performance, flexibility and transparency hold great promise in multifunctional devices. We demonstrate an all solid-state, transparent and flexible supercapacitor using a simplified electrode fabrication approach. Device is comprised of 2D multi-layered reduced graphene oxide electrodes on ITO-coated polyethylene terephthalate substrates stacked with a polymer gel electrolyte. The transparent device exhibited good capacitance behavior at scan rates ranging from 20 mV/s all the way up to 1 V/s.
||Planned: TMS Journal: Journal of Electronic Materials