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Meeting 2016 TMS Annual Meeting & Exhibition
Symposium Recent Advancement on Stretchable and Wearable Electronics
Presentation Title Materials Integration for Flexible Electronics: Cu-interconnects, Supercapacitors
Author(s) Tolga Aytug, Pooran Joshi, Matthew S. Rager
On-Site Speaker (Planned) Tolga Aytug
Abstract Scope We present photo-thermochemical processing of inkjet-printed CuO nanoparticles for efficient fabrication of Cu electrodes as a cost-effective alternative to complex lithographic techniques for large-scale fabrication of flexible electronic devices. Pulse-thermal processing (PTP) technique was used to reduce CuO to Cu and subsequently sinter the Cu nanoparticles on flexible, silica-coated PET substrates. The effects of PTP on print conductivity and mechanical stability were studied as a function of pulse intensity, number of pulses and pulse duration. Supercapacitors combining the synergic advantages of improved electrochemical performance, flexibility and transparency hold great promise in multifunctional devices. We demonstrate an all solid-state, transparent and flexible supercapacitor using a simplified electrode fabrication approach. Device is comprised of 2D multi-layered reduced graphene oxide electrodes on ITO-coated polyethylene terephthalate substrates stacked with a polymer gel electrolyte. The transparent device exhibited good capacitance behavior at scan rates ranging from 20 mV/s all the way up to 1 V/s.
Proceedings Inclusion? Planned: TMS Journal: Journal of Electronic Materials

OTHER PAPERS PLANNED FOR THIS SYMPOSIUM

3D Printing Liquid Metals at Room Temperature for Fabrication of Functional, Stretchable, and Soft Electronics
A New Architecture for Flexible Large-area Electronic Systems
B-1: Printing of Graphene-coated Copper Nano-ink on Flexible Substrate Using Light Sintering Method
DFT Approach to Electronic and Optical Properties of Foldable and Stretchable Graphene
Flexible Copper Clad Laminate prepared by Roll-to-Roll Additive Manufacturing
Inkjet Printed Metal Oxide Thin Film Transistors
Laser Writing and Photonic Reduction of High Performance Supercapacitors on Flexible Substrates
Materials Integration for Flexible Electronics: Cu-interconnects, Supercapacitors
Mechanical Stability of Printed Metallizations on Polymer Substrates
New Paradigms for Enabling Printing of Flexible Optoelectronics through Engineered Metal-organic Inks and Direct Writing
Post Processing and In Situ Processing for Low Thermal Budget Integration of Electronic Materials on Flexible Substrates
RF Devices based on 2D Materials for Flexible and Wearable Electronics
Self-sensing Ionic Polymer-metal Composite Soft Robotic Actuator Integrated with Gallium-indium Alloy
Silver Nanowire Networks for Flexible Electromagnetic Interface Shields
Ultrasonic Spray Printing for High-performance Flexible Organic Field-effect Transistors and Hybrid Perovskite Solar Cells
Wearable Energy Storage Devices from Cotton T-shirts
Wireless Gas Sensing with NFC-enabled Mobile Device

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