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Meeting 2018 TMS Annual Meeting & Exhibition
Symposium Fracture: 65 Years after the Weibull Distribution and the Williams Singularity
Presentation Title Limitations and Applicability of LEFM to Spalling Fracture in Single Crystal Semiconductors
Author(s) Corinne E Packard
On-Site Speaker (Planned) Corinne E Packard
Abstract Scope Spalling fracture has been engineered to controllably and intentionally exfoliate thin film electronic devices from single crystal semiconductors for the purposes of creating flexible devices or enabling substrate use to mitigate costs. The process uses a sub-critical stressor layer, combined with an externally applied mechanical force, to initiate and propagate a lateral fracture parallel to the substrate surface. Devices have been successfully removed from silicon, gallium arsenide, germanium, and gallium nitride substrates using this method. The spontaneous spalling model of Suo & Hutchinson has been used to model behavior in these systems, approximating spall depth and critical spalling conditions reasonably well. This talk will discuss the areas where the LEFM model succeeds in approximating spall depth and critical spalling conditions as well as its limitations with respect to edge effects, elastic and plastic anisotropy, and dynamic behavior during crack propagation that are inherent to this application space.
Proceedings Inclusion? Planned: Supplemental Proceedings volume


A Data-driven Approach to Predict Microstructurally Small Crack Evolution
A Probability Model for Stress Rupture Failure of Carbon Composites, Incorporating Weibull Fiber Strength Statistics, Local Fiber Load Sharing, and Matrix Creep
An Integrity Basis of Fracture Challenges
Applicability of Weibull Statistics for Micro- and Nano-scale Silicon Components
Comparison of Methods to Find the Weibull Stress Parameters
Composite Overwrapped Pressure Vessel (COPV) Life Test
Computational Procedure for Designing New Gen 3 Steels with High Formability and Ductile Fracture Resistance
Forward Propagation of Random Microstructural Features for Reliability Estimates of Engineering Structures
Fracture Behavior of High Performance Sheet Steel
Fracture Toughness of Silicon by Variable Temperature Micropillar Splitting
Grain and Sub-grain Level Strains ahead of an Evolving Fatigue Short Crack as Measured by X-ray Techniques
High Temperature Cracking Damage of Calcium Aluminate Cements
K-dominance of Atomistic Cracks
Limitations and Applicability of LEFM to Spalling Fracture in Single Crystal Semiconductors
NASA's Plan for Development and Transition of Computational Materials-based Capabilities for Next-generation Durability / Damage Tolerance and Additive Manufacturing
On the Experimental Evaluation of the Fracture Toughness of Shape Memory Alloys
On the Prediction of Failure in 6016 Aluminum Alloy Sheet by GISSMO Damage Model
Physical and Computational Aspects of Engineering Damage Mechanics
Predicting Joint Strength: Evaluating Interface Corner Stress Intensity Factor and Cohesive Zone Modeling Approaches
Re-tooling the Engineering Predictive Practices for Durability and Damage Tolerance
Singularities of Dynamic Cracks
Size, Temperature, Environmental Effects on Brittle Fracture (BDT)
The Complexity of Ductile Fracture
The Effect of Loading Rate on Fracture Toughness of Low Ductility Materials
Toughness, Roughness and Crack Path Engineering for Improved Ductile Fracture Resistance
Trends in Microstructure-sensitive Computational Approaches to Fatigue Cracking
Use of Weibull Distribution to Characterize High Performance Fibers
Using R-curves to Predict Fatigue Behavior in Crack Bridging Toughened Ceramics
Void Initiation during Ductile Rupture of Pure Metals
Weibull Analysis of High Strength Ni- and Fe-based Bulk Metallic Glasses

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