|About this Abstract
||2017 TMS Annual Meeting & Exhibition
||Fracture Properties and Residual Stresses in Small Dimensions
||Improved Fracture Resistance of Brittle Molybdenum Thin Films on Polyimide with Stress Tailoring
||Megan Cordill, Tanja Jörg, Oleksandr Glushko, Robert Franz, Jörg Winkler, Christian Mitterer
|On-Site Speaker (Planned)
Molybdenum has emerged as the material of choice for electronic applications due to its high thermal stability, chemical inertness, and low electrical resistance. Recently attention has been focused on the fracture behavior of these brittle thin films on polymers and their utilization in flexible electronics. This study reports on magnetron sputter deposited molybdenum films on polyimide substrates and how the residual stress of the thin films can be tailored to control the electro-mechanical behavior. In-situ characterization techniques were used to examine the mechanical and electrical response of the films during straining. Tensile tests were performed with in-situ resistance and x-ray diffraction measurements to determine the fracture strain of the films, while the crack evolution during straining was investigated with optical microscopy. In general, a high compressive stress state enabled the Mo films to withstand much higher tensile strains before the loss of conductivity and severe cracking occurred.