|About this Abstract
||2017 TMS Annual Meeting & Exhibition
||Alloys and Compounds for Thermoelectric and Solar Cell Applications V
||Transient Liquid Phase Bonding of Cu/Ga/Ni and Cu/Ga/Co and Phase Equilibria of Cu-Ga-Ni and Co-Cu-Ga Ternary Systems
||Ji-min Lin, Sinn-wen Chen, Tsu-ching Yang
|On-Site Speaker (Planned)
Thermoelectric modules have attracted a lot research interests because they can convert heat directly into electricity, and have great potential in waste heat recovery. Usually thermoelectric modules are composed of arrays of P-N thermoelectric devices, and there are thus many joints in thermoelectric modules. Transient liquid phase bonding using Ga is a potential joining technique for thermoelectric models which are joined at lower temperatures and can be used at higher temperatures. The interfacial reactions at the Cu/Ga/Ni and Cu/Ga/Co contacts are examined at 200°C, 350°C and 500°C. For one hour reaction, a 23-µm-thick Cu<SUB>9</SUB>Ga<SUB>4</SUB> phase layer is formed at the Cu/Ga contact when reacted at 350°C while a 13-µm-thick CuGa<SUB>2</SUB> phase layer is formed at 200°C. A 38-µm-thick CoGa<SUB>3</SUB> phase layer is formed at the Ga/Co contact when reacted at 350°C for 1 hour. The reaction paths are determined, and are illustrated with the determined Cu-Ga-Ni and Co-Cu-Ga isothermal sections.
||Planned: Supplemental Proceedings volume