|About this Abstract
||2017 TMS Annual Meeting & Exhibition
||Advanced Thermo-mechanical Characterization of Materials with Special Emphasis on In Situ Techniques
||In Situ Characterization of Electromigration and Thermal Cycling Damage and Grain Growth in Cu/Pure Sn/Cu Solder Joints
||Antony Kirubanandham, Nikhilesh Chawla
|On-Site Speaker (Planned)
Electromigration and thermal cycling damage evolution was studied in situ in a scanning electron microscope (SEM) on Cu/Sn/Cu solder joints. The evolution of Sn grain structure was also analyzed in situ using Electron Backscatter Diffraction (EBSD). To isolate the influence of atmosphere, experiments were done both ex situ and in situ in an SEM. Similarly, to isolate the influences of electrical and thermal components on observed electromigration damage, several thermal aging and current stressing experiments were done in both interrupted and un-interrupted conditions. In situ thermal cycling was conducted between 25oC and 150oC to accelerate the damage mechanisms during interrupted thermal aging tests and study the long term thermal and mechanical stability. The contribution of each component on observed damage features such as grain boundary ledges, intermetallic delamination and fracture, and Sn grain growth will be elucidated.
||Planned: Supplemental Proceedings volume